Track 1
Großer Saal | 1.1 Opening Session: Plenary, Awards Ceremony & Keynote Addresses | | | | | | | | | | | | |
Track 1
Saal 2 | | | | 2.1 Executive Track Panel: Enabling a Connected World via Internet of Things | | | 3.1 Executive Track Panel: New Opportunities in Automotive Electronics | | | | 4.1 Executive Track Panel: Trends & Challenges to Ensure Security | | |
Track
Exhibition Area | | CB1 Coffee Break | | | | | | | | CB2 Coffee Break | | | |
Track
Booth 15, Exhibition Area | | | UB01 Session 1 | | UB02 Session 2 | | | UB03 Session 3 | | | | UB04 Session 4 | |
Track
Großer Saal + Saal 1 | | | | | | LB1 Lunch Break | | | | | | | |
Track
Conference Level, Foyer | | | | | | | | | IP1 Interactive Presentations | | | | |
Track
Exhibition Area (Terrace Level) | | | | | | | | | | | | | Exhibition-Reception |
Track 2
Konferenz 6 | | | | 2.2 Embedded Tutorial: The Dark Silicon Problem: Technology to the Rescue? | | | 3.2 Hot Topic: 3D ICs: Leap Forward to 1,000X Performance | | | | 4.2 Hot Topic: Nanoelectronic Design Tools Addressing Coupled Problems for 3D-IC Integration | | |
Track 3
Konferenz 1 | | | | 2.3 Automotive Systems and Smart Energy Systems | | | 3.3 On-Chip Security Testing | | | | 4.3 Firmware Security | | |
Track 4
Konferenz 2 | | | | 2.4 Physical Design for Cutting-edge Lithography | | | 3.4 Application-specific Low-power Techniques | | | | 4.4 System-Level Energy Management | | |
Track 5
Konferenz 3 | | | | 2.5 Energy Efficient Systems and Architectures | | | 3.5 Emerging Devices and Methodologies for Energy Efficient Systems | | | | 4.5 Ultra-low Energy Memory Devices | | |
Track 6
Konferenz 4 | | | | 2.6 Fault-Tolerant Embedded Systems | | | 3.6 Timing Analysis and Measurement | | | | 4.6 Managing Multi-Core and Flash Memory | | |
Track 7
Konferenz 5 | | | | 2.7 Variability Challenges in Nanoscale Designs | | | 3.7 Dealing with Runtime Failures | | | | 4.7 Modeling of Devices and Mixed-Signal Circuits | | |
Track 8
Exhibition Theatre | | | | 2.8 Revolutionising the Teaching of Computer Architecture and System on Chip Design | | | 3.8 Presentations from FDSOI-Campus and from European Projects Booths: Leveraging new Semiconductor Technologies | | | | 4.8 Presentations from IoT-Campus (I): ASIC and Sensor Solutions | | |
