Keynotes at DATE 2016

2016-01-18

TUESDAY OPENING CEREMONY (Session 1.1)

Luc Van den hove1. Keynote: From the happy few to the happy many - Towards an intuitive internet of things.

Luc Van den hove, President and CEO, imec, BE

Abstract: The last year every high-tech company was talking about the Internet of Things. The coming decade, we will indeed see a rise in smart connected systems. Machines, buildings, vehicles, personal appliances will all be equipped with more intelligence that will be interconnected. Smart systems will be unobtrusive, ultra-small, cheap, intelligent, and ultra–low power. They will include sensors, actuators, and processing and communication abilities, often in a one-chip wireless solution.

Imec aims at bringing the Internet of Things to the next level. Imec develops the building blocks to create an easy-to-use Internet of Things that surrounds us, that interacts with us as individuals, that learns our habits, our preferences, our health…

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An Internet of Things that will connect diverse unconnected systems. That will turn the massive amount of measured data in information to make the right decisions, to take the right actions exactly as we need or want. Of course taking into account our privacy preferences.

This Intuitive Internet of Things will help manage the sustainability, complexity and safety of our world. It will increase our comfort and wellbeing. Not only of the happy few. Imec will bring the Intuitive Internet of Things to the happy many.

Bio: Luc Van den hove is President and Chief Executive Officer (CEO) of imec since July 1, 2009. Before holding this position he was Executive Vice President and Chief Operating Officer. He joined imec in 1984, starting his research career in the field of silicide and interconnect technologies. In 1988, he became manager of imec’s micro-patterning group (lithography, dry etching); in 1996, Department Director of Unit Process Step R&D; and in 1998, Vice-President of the Silicon Process and Device Technology Division. In January 2007, he was appointed as imec's Executive Vice President & Chief Operating Officer (COO).

Under his guidance imec has grown to an organization with a staff of around 2300 people, operating with an annual budget of around 400M€ (2015) and with offices in Belgium, the Netherlands, US, Japan, Taiwan, China and India.
Currently, Luc Van den hove is also professor of Electrical Engineering at the University of Leuven. He is also a member of the Technology Strategy Committee of ASML.
He has authored or co-authored more than 150 publications and conference contributions. He is a frequently solicited speaker on technology trends and applications for nano-electronics at major top conferences. He has presented more than 30 key note presentations.
Luc Van den hove received his Ph.D. in Electrical Engineering from the University of Leuven, Belgium.

Antun Domic2. Keynote: Design Will Make Everything Different

Antun Domic, Executive Vice President and General Manager, Design Group, Synopsys, US

Abstract: How many different silicon manufacturing process technologies will there be at 10, 7, or 5 nanometers? Probably only three. How many design starts will there be at 10, 7, or 5 nanometers? According to IBS [1], in 2025 there will be less than 250 design starts at 10 nanometers and below, about 3% of the total number of design starts that year, and only about five of those design starts, i.e. 2% of the 3% (0.05% of the total) will take place in Europe. But this is not the end! This is not even the beginning of the end. There is a great deal of opportunity beyond the relentless progression of Moore’s law. Design innovation can be the enabler, and the differentiator, regardless of the process technology node.

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Automotive is a great example: according to Bosch [2], electronics represents 80% of the innovation in cars, and 40% of its cost; the car is a computer – actually, over one hundred computers – on four wheels already, and it will get smarter and smarter, with new layers of services and players just around the corner. Design, and design automation can help increase and accelerate innovation, and at the same time, improve efficiency. The “Internet of Things” is another, potentially greater example: smartness going way beyond the phone. Everything will get smarter: cars, homes, cities, agriculture, farming, factories, etc. Most of the IoT enablement and differentiation will stem from design, and design automation, which include IP, and an increasing amount of software. After performance and power consumption, systems reliability and security have already become critical design considerations at the dawn of a new era, in which design will be critical to make everything better.”

[1] Design Starts by Geographic Region 2010-2025, International Business Strategies, Inc. (IBS), 2015
[2] “Can EDA Solve the Problems of Electronic Design for the Car of the Future?”, Peter van Staa, Robert Bosch, ICCAD 2014 Keynote Address

Bio: Dr. Antun Domic serves as executive vice president and general manager of the Design Group at Synopsys, Inc. where he is responsible for leading the development of the company's implementation and analog/mixed-signal product lines.

Prior to joining Synopsys in 1997, Dr. Domic worked at Cadence Design Systems; at the Microprocessor Group of Digital Equipment Corporation in Hudson, Mass.; and at the Massachusetts Institute of Technology (MIT) Lincoln Laboratories in Lexington, Mass. Dr. Domic holds a BS from the University of Chile in Santiago, and a PhD in Mathematics from MIT.

WEDNESDAY Lunchtime (Session 7.0 – 1400 - 1430)

Patrick Leteinturier3. Keynote: Title: The Car of the Future will reinvent personal mobility

Patrick Leteinturier, Fellow Automotive Systems, Infineon Technologies, DE

Abstract: The regulations for CO2 and pollutant reduction have pushed the automotive industry for more electrification. The internal combustion engines will continue to power our vehicles for decades but will be assisted by electric traction in various xEV architectures. The race for efficiency, environment friendly, and safety will not end here. Automated and autonomous driving cars are opening a new field of benefits, but also a new field of challenges. The engineers will have to reinvent the EE vehicle architecture for new domain control and fail operational systems. The cars will be connected to other cars and the infrastructure with software update over the air. The new vehicles will be real cyber physical systems. This keynote will explore the potential of electronic technologies to solve the new requirements in sensing, controlling, powering, energizing the car of the future.

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Bio:

Professional career

1990-1992

1992-1997

1997-1999

1999-2015

Development engineer at JV Lucas (UK) & SAGEM (France) for engine management systems.

Chief engineer at SAGEM (France) in charge of PSA and Renault Powertrain projects.

Development engineer at Siemens-Semiconductor for automotive 32bit TriCore µC

Various positions at Infineon technologies AG

Current position;

responsibilities

since 2013

Automotive System Technical Fellow

As Technical Fellow Patrick Leteinturier is responsible for system architecture of silicon products (silicon sensors, microcontrollers, silicon smart powers, and power modules) for Engine, Transmission and xEV applications.

Additional information

  • A member of SAE International since 1998, Mr. Leteinturier received the SAE International Forest R. McFarland Award (2008). In 2010, he was named an SAE International Fellow. Mr. Leteinturier is currently SAE director and member of the SAE Engineering Meeting Board.
  • Mr. Leteinturier is Guest Professor Tianjin University in China (since 2006).
  • Mr. Leteinturier received his Mechanical Engineering degree from ENSAM: Ecole Nationale Supérieure des Arts et Métiers (France) in 1987, his Master of Advanced Studies in Internal Combustion Engines (DEA) at the University Paris 6 (France), and his Electric & Electronic Engineering degree from ESE: Ecole Supérieure d’Electricité (France) in 1990.

THURSDAY Lunchtime (Session 11.0 1330-1400)

Walden (Wally) C. Rhines4. Keynote: Secure Silicon: Enabler for the Internet of Things

Walden (Wally) C. Rhines, Chief Executive Officer and Chairman of the Board of Directors, Mentor Graphics Corporation, US

Abstract: As electronic system hackers penetrate deeper—from applications to embedded software to OS to silicon—the impact of security threats is growing exponentially. Viruses and malware in the operating system, or application layer, are major concerns, but only affect a portion of users. In contrast, even small malicious modifications or compromised performance in the underlying silicon can devastate system security for all users. Growth of the Internet of Things magnifies the impact of the security problem by orders of magnitude.

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Since hardware is the root of trust in an electronic product, EDA companies will be increasingly pressured to solve the silicon security problems for their customers. This requires a new paradigm in silicon design creation and verification. The traditional EDA role is to design and then verify that the silicon does what it is supposed to do. Creating secure silicon, however, requires that verification ensure that the chip does nothing that it is NOT supposed to do.

The industry is at the first stage of Secure Silicon awareness; it’s going to become big business as future events unfold. Join Wally Rhines as he examines the growing threats to silicon security and EDA’s possible solutions.

Bio: WALDEN C. RHINES is Chairman and Chief Executive Officer of Mentor Graphics, a leader in worldwide electronic design automation with revenue of $1.24 billion in 2014. During his tenure at Mentor Graphics, revenue has nearly quadrupled and Mentor has grown the industry’s number one market share solutions in three of the ten largest product segments of the EDA industry.

Prior to joining Mentor Graphics, Rhines was Executive Vice President of Texas Instruments’ Semiconductor Group, sharing responsibility for TI’s Components Sector, and having direct responsibility for the entire semiconductor business with more than $5 billion of revenue and over 30,000 people.

During his 21 years at TI, Rhines managed TI’s thrust into digital signal processing and supervised that business from inception with the TMS 320 family of DSP’s through growth to become the cornerstone of TI’s semiconductor technology. He also supervised the development of the first TI speech synthesis devices (used in “Speak & Spell”) and is co-inventor of the GaN blue-violet light emitting diode (now important for DVD players and low energy lighting). He was President of TI’s Data Systems Group and held numerous other semiconductor executive management positions.

Rhines has served five terms as Chairman of the Electronic Design Automation Consortium and is currently serving as a director. He is also a board member of the Semiconductor Research Corporation and First Growth Family & Children Charities. He has previously served as chairman of the Semiconductor Technical Advisory Committee of the Department of Commerce and as a board member of the Computer and Business Equipment Manufacturers' Association (CBEMA), SEMI-Sematech/SISA, Electronic Design Automation Consortium (EDAC), University of Michigan National Advisory Council, Lewis and Clark College and SEMATECH.

Dr. Rhines holds a Bachelor of Science degree in metallurgical engineering from the University of Michigan, a Master of Science and Ph.D. in materials science and engineering from Stanford University, a master of business administration from Southern Methodist University and an Honorary Doctor of Technology degree from Nottingham Trent University.