Date: Tuesday 15 March 2016
Time: 14:30 - 16:00
Location / Room: Konferenz 6

Organiser:
Vikas Chandra, ARM, US

Chair:
Vikas Chandra, ARM, US

Co-Chair:
Norbert Wehn, University of Kaiserslautern, DE

In this session, we will cover the entire spectrum of innovations in 3D-IC integration to applications which would give benefits of multiple orders of magnitude and everything in between. First talk focuses on discussing N3XT architecture to improve the energy efficiency of abundant-data applications significantly, thereby enabling new frontiers of applications for both mobile devices and the cloud. Second talk discusses the opportunities brought by 3D sequential integration and highlights the applications benefiting from a very small 3D contact pitch. Third talk concludes the session with the discussion of the interactions of upcoming 3D-IC technologies and the system-level interconnect hierarchy to design the next generation applications.

Time	Label	Presentation Title Authors
14:30	3.2.1	THE N3XT 1,000X Speaker and Author: Subhasish Mitra, Stanford University, US
15:00	3.2.2	3D SEQUENTIAL INTEGRATION FOR MONOLITHIC 3DIC DESIGN Speaker and Author: Olivier Billoint, CEA-Leti, FR
15:30	3.2.3	3D TECHNOLOGY DRIVEN BY 3D APPLICATION REQUIREMENTS: A 3D-LANDSCAPE FOR 3D SYSTEM DESIGN Speaker and Author: Dragomir Milojevic, IMEC, BE
16:00		End of session Coffee Break in Exhibition Area