Thursday 17 March 2016 At-A-Glance

Printer-friendly version PDF version

Interactive Presentations: 10:00 - 10:30 IP4 (in room Conference Level, Foyer) / 15:30 - 16:00 IP5 (in room Conference Level, Foyer)

Track /
Room
08:30 - 10:0010:00 - 10:3010:00 - 11:0010:00 - 12:0011:00 - 12:3012:00 - 14:3012:30 - 14:0013:15 - 13:3013:30 - 14:0014:00 - 17:3014:00 - 15:3014:30 - 16:3015:30 - 16:0016:00 - 17:30
Track 1
Saal 2
9.1 SPECIAL DAY Embedded Tutorial: Embedded Systems Security10.1 SPECIAL DAY Hot Topic: Lightweight Security for Embedded Processors11.1 SPECIAL DAY Hot Topic: Embedded Security Applications12.1 SPECIAL DAY Hot Topic: Design Methods for Security and Trust
Track 2
Konferenz 6
9.2 Managing the Traffic Jam in NoC10.2 Does it Work or NoC?11.2 Beating New Technology Paths for NoC12.2 Hot Topic: Exploiting New Transistor Technologies to Enhance Hardware Security (without PUFs!)
Track 3
Konferenz 1
9.3 Industrial Experiences10.3 Design Experiences for Multimedia and Communication Applications11.3 Microarchitectures and Workload Allocation for Energy Efficiency12.3 System Support for Resilience and Robustness
Track 4
Konferenz 2
9.4 Optimization for Logic and Physical Design10.4 Stochastic Methods for Circuit Analysis & Synthesis11.4 Automating Test Generation, Assertions and Diagnosis12.4 Simulating Everything: From Timing to Instructions
Track 5
Konferenz 3
9.5 Formal Bit Precise Reasoning10.5 Enhancing Memory in Next-Generation Platforms11.5 Design of Efficient Microarchitectures12.5 Accelerator Design and Heterogeneous Architectures
Track 6
Konferenz 4
9.6 Real-Time Scheduling10.6 Compilers and Tools for GPUs and MPSoCs11.6 Applications of Reconfigurable Computing12.6 Reconfigurable Computing Platforms and Architectures
Track 7
Konferenz 5
9.7 Temperature Awareness in Computing Systems10.7 Reliable System Design11.7 Naked Analog Synthesis12.7 Formal System Level Verification
Track 8
Exhibition Theatre
9.8 Embedded Tutorial: Analog-/Mixed-Signal Verification Methods for AMS Coverage Analysis10.8 Presentations from Campus 3D-IC Integration: Opportunities for SMEs and Outlook 2020+11.8 Launch of the Worldwide MEMS Design Contest
Track
Conference Level, Foyer
IP4 Interactive PresentationsIP5 Interactive Presentations
Track
Exhibition Area
CB5 Coffee BreakCB6 Coffee Break
Track
Booth 15, Exhibition Area
UB09 Session 9UB10 Session 10UB11 Session 11
Track
Großer Saal + Saal 1
LB3 Lunch Break
Track
Saal 2
Best-IP Best IP Award Presentation
Track 0
Saal 2
11.0 LUNCH TIME KEYNOTE SESSION