The field of integrated photonics holds great promise for overcoming societal challenges in data and telecom, autonomous driving and healthcare in terms of cost, performance, and scalability. Similar to the semiconductor industry, the ever-increasing demands of various applications are driving the necessity for platform integration in photonics as well, enabling seamless integration of diverse functionalities into compact and efficient photonic devices. This high level of integration reduces footprint and drives down system level costs. In this trend towards high levels of integration , Indium Phosphide (InP) is the material of choice for long-distance communication lasers, owing to its proven track record over several decades. Leveraging standardized fabrication processes, the cost and performance targets can be addressed. The key advantages of InP-based integration lie in its ability to fully integrate lasers, amplifiers, modulators, and passives, providing a flexible and reliable platform for building complex Photonic Integrated Circuits (PICs). This paper will address the photonic integration platforms, the applicability to current and future markets requiring the need for further heterogenous integration with other technologies, and the change to a foundry business model, much like its electronics counterpart.