Welcome to the DATE 2023 Website


Useful information on preparing your presentation for DATE 2023, please visit https://www.date-conference.com/av-guidelines and refer to the section that applies for your presentation type.

The time zone for all times mentioned at the DATE website is CEST – Central Europe Summer Time (UTC+1). AoE = Anywhere on Earth.

Tue, 28 Feb 2023 11:38

EDAA Achievement Award 2023 goes to Jason Cong

Jason CongThe Achievement Award is given to individuals who made outstanding contributions to state of the art in electronic design, automation and testing of electronic systems in their life. To be eligible, candidates must have made innovative contributions that impacted how electronic systems are being designed.

Past recipients have been Kurt ANTREICH (2003), Hugo DE MAN (2004), Jochen JESS (2005), Robert BRAYTON (2006), Tom W. WILLIAMS (2007), Ernest S. KUH (2008), Jan M. RABAEY (2009), Daniel D. GAJSKI (2010), Melvin A. BREUER (2011), Alberto L. SANGIOVANNI-VINCENTELLI (2012), Peter MARWEDEL (2013), Rolf ERNST (2014), Lothar THIELE (2015), Giovanni DE MICHELI (2016), C. L. David LIU (2017), Mary Jane IRWIN (2018), Jacob ABRAHAM (2019), Luca BENINI (2020), Georges GIELEN (2021), and Edward A. LEE (2022).

Dr. Jason Cong is the Volgenau Chair for Engineering Excellence in the UCLA Computer Science Department (with a joint appointment in the Department of Electrical and Computer Engineering), the Director of the Center for Domain-Specific Computing (funded by NSF Expeditions in Computing Award), and the director of VLSI Architecture, Synthesis, and Technology (VAST) Laboratory. He served as the chair of the UCLA Computer Science Department from 2005 to 2008. He is the author of more than 500 papers, including 17 Best Paper Awards. Dr. Cong’s research publications have close to 35,000 citations, according to Google Scholar, and he is a frequent keynote speaker at major conferences in EDA and design automation. He has graduated 44 PhD students.

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Mon, 23 Jan 2023 20:09

Authors' Guidelines for Audio-Visual Presentation

This document describes the guidelines to prepare and present audio-visual materials at DATE 2023. Please read all instructions carefully and follow them strictly to maintain the highest possible standards. Even experienced speakers should read the following paragraphs, as they cover several problems that have arisen over the years.

DATE provides a centralised presentation management system for speakers of D, A, T and E Track sessions, Late Breaking Results paper presentations, Multi-Partner Project presentations, Focus Sessions, Special Day and Special Initiative ASD presentations as well as presentations in line with the Young People Programme. It will not be possible to use own devices for presentations in the session rooms.
The centralised presentation management will not be provided for workshops (incl. Special Initiative ASD workshop) and embedded tutorials. Workshop and embedded tutorial speakers will receive presentation information from the workshop/embedded tutorial organisers.

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Thu, 24 Nov 2022 15:29

Accommodation & Travel

Special hotel room rates and Lufthansa Group airlines fares

  • In cooperation with the Antwerp Convention Bureau, the Conference Organisation offers hotel rooms at favourable rates in Antwerp for all conference delegates.
  • The Lufthansa Group airlines bring people together - every day, all around the world. The global route network of Austrian Airlines, Lufthansa, SWISS, Brussels Airlines and Eurowings offers optimal connection and combination options, so you will benefit from quick and direct flights to the event.
  • In cooperation with Visit Antwerp, Antwerp city pass are offered at discounted prices for DATE 2023 delegates.

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Wed, 26 Oct 2022 13:40

Promotion & Sponsorship

DATE 2023 offers numerous opportunities to get in contact with the DATE community and to advertise novel solutions.

DATE is the perfect opportunity to present and communicate your technological and business capabilities to scientific, industrial and commercial audiences at one single European event. All companies, institutions, universities, initiatives and projects that are linked to DATE as promotion partners or sponsors benefit from the additional visibility of their corporate identity, their products, services, expertise and cause.

The DATE 2023 promotion & sponsorship opportunities brochure gives you and idea of what  DATE 2023 can offer. Tailor-made packages can be arranged to suit your special requests. Feel free to contact us to discuss your needs and ideas.

We would be delighted to welcome you among our promotion partners and sponsors at DATE, and to welcome you in Antwerp for an interesting programme and effective networking.

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Thu, 20 Oct 2022 16:59

Careers Fair - Industry - Call for Submissions

Information for Students

The Young People Programme aims at bringing together Ph.D./Master Students and potential job seekers with recruiters from EDA and microelectronic companies. Interested jobseekers have the opportunity to apply to open positions which will be presented by the companies. If a student raises the interest in the position, an interview will be scheduled.


The following two classes of students are eligible:

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Thu, 20 Oct 2022 13:44

Student Teams Fair

The Student Teams Fair is an innovative initiative of DATE 2023 to bring together student teams participating to international competitions with and personnel from EDA and microelectronic companies. The Teams have the opportunity to present their activities, success stories and challenges, and to receive funding and support by the companies for their future activities.

Student teams will present their activities to the DATE 2023 attendees. Then, a poster session will follow to allow closer interaction of student teams with EDA and microelectronic companies, to allow discussion of sponsorship opportunities, e.g., in terms on monetary sponsorships, licenses, tutorials.


Student teams participating to international competitions, including but not limited to Robocup, Hyperloop and Carolo-Cup.

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Thu, 20 Oct 2022 10:27

Young People Programme

PhD/Master Students initiatives

The DATE 2023 conference includes a number of initiatives targeting PhD and master students, with the goal of increasing their visibility, establishing contacts, and encouraging discussion about their future perspectives with experts of the field.

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Fri, 8 Jul 2022 19:20

War in the Ukraine

Dear DATE community,

We, the DATE Sponsors Committee (DSC) and the DATE Executive Committee (DEC), are deeply shocked and saddened by the tragedy currently unfolding in Ukraine, and we would like to express our full solidarity with all the people and families affected by the war.

Our thoughts also go out to everyone in Ukraine and Russia, whether they are directly or indirectly affected by the events, and we extend our deep sympathy.

We condemn Russia’s military action in Ukraine, which violates international law. And we call on the different governments to take immediate action to protect everyone in that country, particularly including its civilian population and people affiliated with its universities.

Now more than ever, our DATE community must promote our societal values (justice, freedom, respect, community, and responsibility) and confront this situation collectively and peacefully to end this nonsense war.

DATE Sponsors and Executive Committees.


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OK_1 Opening Keynote 1: Building the Metaverse: Augmented Reality applications and integrated circuit challenges

Mon, 09:00

Edith Beigné, Meta Reality Labs, United States

Edith Beigné, Meta Reality Labs, US

Augmented reality is a set of technologies that will fundamentally change the way we interact with our environment. It represents a merging of the physical and the digital worlds into a rich, context aware and accessible user interface delivered through a socially acceptable form factor such as eyeglasses. One of the biggest challenges in realizing a comprehensive AR experience are the performance and form factor requiring new custom silicon. Innovations are mandatory to manage power consumption constraints and ensure both adequate battery life and a physically comfortable thermal envelope. This presentation reviews Augmented Reality and Virtual Reality applications and Silicon challenges.

OK_2 Opening Keynote 2: The Cyber-Physical Metaverse – Where Digital Twins and Humans Come Together

Mon, 09:45

Dirk Elias, Robert Bosch GmbH, Germany

Dirk Elias, Robert Bosch GmbH, DE

The concept of Digital Twins (DTs) has been discussed intensively for the past couple of years. Today we have instances of digital twins that range from static descriptions of manufacturing data and material properties to live interfaces to operational data of cyber physical systems and the functions and services they provide.

Currently, there are no standardized interfaces to aggregate atomic DTs (e.g., the twin of the lowest-level function of a machine) to higher-level DTs providing more complex services in the virtual world. Additionally, there is no existing infrastructure to reliably link the DTs in the virtual world to the integrated CPSs in the real world (like a car consisting of many ECUs with even more functions).

This keynote will address how the Metaverse can become the virtual world where DTs of humans and machines live and how to reliably connect DTs to the physical world. Insights in current activities of Bosch Research and its academic partners to move towards this vision will be provided.

LK_1 IEEE CEDA Distinguished Lecturer Lunchtime Keynote: Restoring the magic in design

Mon, 13:00

Jan M. Rabaey,  University of California at Berkeley, United States and imec, Belgium

Jan M. Rabaey,  University of California at Berkeley, United States and imec, BE

The emergence of “Very Large Scale Integration (VLSI)” in the late 1970’s created a groundswell of feverish innovation. Inspired by the vision laid out in Mead and Conway’s “Introduction to VLSI Design”, numerous researchers embarked on venues to unleash the capabilities offered by integrated circuit technology. The introduction of design rules, separating manufacturing from design, combined with an intermediate abstraction language (CIF) and a silicon brokerage service (MOSIS) gave access to silicon for a large population of eager designers. The magic however expanded way beyond these circuit enthusiasts and attracted a whole generation of software experts to help automate the design process, given rise to concepts such as layout generation, logic synthesis, and silicon compilation. It is hard to overestimate the impact that this revolution has had on information technology and society at large.

About fifty years later, Integrated Circuits are everywhere. Yet, the process of creating these amazing devices feels somewhat tired. CMOS scaling, the engine behind the evolution in complexity over all these decades, is slowing down and will most likely peter out in about a decade. So has innovation in design tools and methodologies. As a consequence, the lure of IC design and design tool development has faded, causing a talent shortage worldwide. Yet, at the same time, this moment of transition offers a world of opportunity and excitement. Novel technologies and devices, integrated in three-dimensional artifacts are emerging and are opening the door for truly transformational applications such as brain-machine interfaces and swarms of nanobots. Machine learning, artificial intelligence, optical and quantum computing present novel models of computation surpassing the instruction-set processor paradigm. With this comes a need again to re-invent the design process, explicitly exploiting the capabilities offered by this next generation of computing systems. In summary, it is time to put the magic in design again.

LK_2 Special Day Lunchtime Keynote: Interacting with Socially Interactive Agent

Tue, 13:00

Catherine Pelachaud, CNRS-ISIR, Sorbonne Université, France

Catherine Pelachaud, CNRS-ISIR, Sorbonne Université, FR

Our research work focuses on modeling Socially Interactive Agents, i.e. agents capable of interacting socially with human partners, of communicating verbally and non-verbally, of showing emotions. but also of adapting their behaviors to favor the engagement of their partners during the interaction. As partner of an interaction, SIA should be able to adapt its multimodal behaviors and conversational strategies to optimize the engagement of its human interlocutors. We have developed models to equip these agents with these communicative and social abilities. In this talk, I will present the works we have been conducted.

LK_3 Special Day Lunchtime Keynote: Analyze the Patient, engineer the therapy

Wed, 13:00

Liesbet Lagae, KU Leuven, Belgium

Liesbet Lagae, KU Leuven, BE

The complexity, cycle time and cost of new precision therapy workflow are a major challenge to overcome in order to achieve clinical implementation of this revolutionary type of treatments. For example, car T cells use the patient’s own immune (T-)cell adapted in a way to better fight cancer.  Chip technology can help to make these therapies more efficient, precise, and cost-effective. Over the last few decades, the semiconductor industry has grown exponentially, poised to increase value to the end-user while driving down costs by scaling. The result is the world’s highest standard in precision and high-volume production of nanoelectronics chip-based sensor solutions.  Imec has used its semiconductor process expertise and infrastructure to make significant innovations in single-use silicon biochip and microfluidic technology, creating toolboxes of on-chip functions spanning DNA sequencing, cell sorting, single cell electroporation, integrated biosensor arrays.   The solutions have until now mostly served the diagnostic market. Chip based microfluidics is a toolbox that brings its own design challenges, especially in relation to not having to reinvent the wheel every time. Hence, we try to make maximal reuse of generic fluidic building blocks developed for the diagnostic market, and we will explain how these building blocks are equally adapted for addressing the challenges in immune therapy. These existing demonstrations on chip could enable to provide smarter solutions for discrete unit operations and quality monitoring to even complete workflow integration.  Solving these challenges would enable more patients to access and benefit from the next most anticipated class of life changing therapies.

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