W07 European Workshop on Silicon Lifecycle Management (eSLM)

Start
Friday, 18 March 2022 08:00
End
Friday, 18 March 2022 18:00
Important Dates
Submission Deadline
Notification of acceptance
Camera-ready material
Organizer
Mehdi Tahoori, Karlsruhe Institute of Technology, Germany
General Chair
Yervant Zorian, Synopsys, United States

Scope and Aim –With increasing system complexity, security, stringent runtime requirements for functional safety, and cost constraints of a mass market, the reliable and secure operation of electronics in safety-critical, enterprise servers and cloud computing domains is still a major challenge. While traditionally design time and test time solutions were supposed to guarantee the in-field dependability and security of electronic systems, due to complex interaction of runtime effects from running workload and environment, there is a great need for a holistic approach for silicon lifecycle management, spanning from design time to in-field monitoring and adaptation. Therefore the solutions for lifecycle management should include various sensors and monitors embedded in different levels of the design stack, access mechanisms and standards for such on-chip and in-system sensor network, as well as data analytics on the edge and in the cloud. This European edition of the eSLM Workshop tries to build a community around this topic and offer a forum to present and discuss these challenges and emerging solutions among researchers and practitioners alike.

Topic Areas – You are invited to participate and submit your contributions to the eSLM Workshop. The workshop’s areas of interest include (but are not limited to) the following topics:

  • Design and placement of various sensors   and monitors for functional safety and security
  • Standards for sensor data aggregation
  • Data analytics for sensor data processing
  • Anomaly detection for security and   functional safety
  • Machine learning for in-field system health monitoring
  • Multi-layer dependability evaluation
  • In-field verification and validation
  • Fault tolerance and self-checking circuits
  • Aging effects on electronics
  • Reuse and extension of test, debug and repair infrastructure for in-filed management
  • Power-up, power-down and periodic tests
  • System level test
  • Preventive Maintenance
  • Concurrent and periodic checking
  • Functional and structural test generation
  • Graceful degradation
  • Useful remaining lifetime prediction
  • Failure prediction and forecasting
  • Attack prediction and prevention
  • In-field configuration and adaptation
  • Cross-layer solutions

Submission Instructions – The Workshop asks for the submission of Extended Abstracts of maximum two pages; camera ready version can be extended up to 4 pages.  All submissions will be evaluated for selection with respect to their suitability for the workshop, originality, technical soundness, and presented results. Selected submissions can be accepted for regular or short presentation at the Workshop.

Submission website: https://www.softconf.com/date22/eSLM/

Key Dates

  Submission deadline           : January 15, 2022

  Notification of acceptance  : February 15, 2022

  Camera-ready material       :  March 1, 2022