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W06 Tips and Tricks for a Successful Multi-Project-Wafer (MPW) Chip

Start
Wed, 27 Mar 2024 14:00
End
Wed, 27 Mar 2024 18:00
Organiser
Clive Holmes, Europractice, United Kingdom
Organiser
Tobias Vanderhenst, imec / EUROPRACTICE, Belgium
Organiser
Paul Malisse, imec / EUROPRACTICE, Belgium
Organiser
Thomas Drischel, Fraunhofer IIS / EUROPRACTICE, Germany

 

Multi-Project-Wafer (MPW) prototyping is a cost-effective and fast way to fabricate, test and validate new chip designs. However, it also poses several challenges and pitfalls that can compromise the quality and functionality of the final chip. This leads to eventual design iterations, extending the initial timeline and increasing costs.
In this workshop, EUROPRACTICE experts will discuss the best practices and lessons learned from the MPW prototyping process, sharing practical tips and tricks on avoiding common errors, optimising the design for tape-out, and troubleshooting the issues that may arise.
We will also discuss how to select the appropriate test and packaging options, especially for smaller advanced nodes. In addition, we will showcase some successful examples and case studies of MPW prototyping from different domains and applications. Finally, we will explain how to access the EUROPRACTICE platform, which provides affordable MPW fabrication services in a wide range of technologies, including ASICs, MEMS, Photonics, Microfluidics, Flexible Electronics, and more.
The workshop is intended for anyone who is interested in or involved in MPW prototyping, from beginners to experts.

Introduction to MPW fabrication with EUROPRACTICE

Session Start
Wed, 14:00
Session End
Wed, 14:15
Speaker
Paul Malisse, imec / EUROPRACTICE, Belgium

RTL signoff analysis

Session Start
Wed, 14:15
Session End
Wed, 15:00
Speaker
Kwan Cheung , UKRI-STFC / EUROPRACTICE, United Kingdom
Speaker
Domas Druzas, UKRI-STFC / EUROPRACTICE, United Kingdom

Choosing a technology for your design

Session Start
Wed, 15:00
Session End
Wed, 15:45
Speaker
Domas Druzas, UKRI-STFC / EUROPRACTICE, United Kingdom

Design finishing and sign off

Session Start
Wed, 16:15
Session End
Wed, 17:00
Speaker
Tobias Vanderhenst, imec / EUROPRACTICE, Belgium
Speaker
Syed Shahnawaz, Fraunhofer IIS / EUROPRACTICE, Germany

Selecting a packaging solution

Session Start
Wed, 17:00
Session End
Wed, 17:45
Speaker
Tobias Vanderhenst, imec / EUROPRACTICE, Belgium