Identification, characterization and modeling of defects, faults and degradation mechanisms; defect-based fault analysis; reliability analysis and modeling, failure mode and effect analysis (FMEA) and physics of failures; noise and uncertainty modeling; test and reliability issues in emerging technologies; modeling and mitigation of physical sources of errors such as process, voltage, temperature and aging variations; process yield modeling and enhancement; design-for-manufacturability and design-for-yield.
Chair: Robert Aitken, ARM, US, Contact
Co-Chair: Michel Renovell, LIRMM, FR, Contact
Members: