W05 Second International Workshop on Resiliency in Embedded Electronic Systems (REES 2017)

Agenda

Time	Label	Session
08:45	W05.1	WELCOME Address
09:00	W05.2	KEYNOTE Address
09:00	W05.2.1	Multi-Layer-Resilience: The Need for Discipline Wolfgang Ecker, Infineon Technologies, DE
09:30	W05.3	Resilient Systems Designs I
09:30	W05.3.1	Introducing Fault Tolerance to the Regularity-Based Resource Partition Model Darrell Knape, Albert M. K. Cheng and Yu Li, University of Houston, Texas, US
09:40	W05.3.2	Architecting Resilient IoT Systems Kemal A. Delic and David M. Penkler, Hewlett Packard Enterprise, FR
09:50	W05.3.3	Utilization of Memristor Variability Towards Brain-Inspired Resilient Computing Rawan Naous¹ and Khaled Nabil Salama² ¹King Abdullah University of Science and Technology, SA; ²KAUST, SA
10:00	W05.3.4	flexMEDiC: flexible Memory Error Detection by Combined Data Encoding and Duplication Norman A. Rink¹ and Jeronimo Castrillon² ¹Technische Universität Dresden, DE; ²TU Dresden, Germany, DE
10:10	W05.4	Poster Discussions (Session I) & Refreshments
10:45	W05.5	Invited Industrial Talks - Resilient Systems in Practise
10:45	W05.5.1	Novel ISO26262 Compliant Architecture for Advanced Driver Assistance Systems Luc van Dijk, NXP Semiconductors, NL
11:15	W05.5.2	Design-for-Resiliency in Dynamically Power Managed Systems Liangzehn Lai, ARM Ltd., GB
11:45	W05.6	Resilient Systems Design II
11:45	W05.6.1	Correction of Transient Faults by Rollback with Low Overhead for Microcontrollers Felix Mühlbauer¹ and Mario Schölzel² ¹Universität Potsdam, DE; ²IHP Frankfurt Oder, DE
11:55	W05.6.2	Prototyping Resilient Processing Cores in Workcraft Georgy Lukyanov¹, Alessandro de Gennaro², Andrey Mokhov³, Paulius Stankaitis² and Maxim Rykunov⁴ ¹Southern Federal University, Rostov-on-Don, RU; ²Newcastle University, GB; ³Newcastle upon Tyne U, GB; ⁴imec, BE
12:05	W05.6.3	Increasing the Robustness of Digital Circuits with Ring Oscillator Clocks Lucas Machado¹, Jordi Cortadella² and Antoni Roca Perez¹ ¹Universitat Politècnica de Catalunya, ES; ²Universitat Politecnica de Catalunya, ES
13:15	W05.7	Invited Industrial Talks - Resilient Design Tools and Methods
13:15	W05.7.1	Simultaneous Measurement of Defect Coverage and Tolerance in AMS ICs for ISO26262 Stephen Sunter, Mentor, CA
13:45	W05.7.2	Error Effect Simulation for Automotive using SystemC Virtual Prototypes Andreas Mauderer, Robert Bosch GmbH, DE
14:15	W05.8	Fault Injection Automation
14:15	W05.8.1	An Automatic Injection Framework for Safety Assessements of Embedded Software Binaries Peer Adelt¹, Bastian Koppelmann², Bernd Kleinjohann¹ and Christoph Scheytt² ¹C-LAB, DE; ²Heinz Nixdorf Institute, DE
14:25	W05.8.2	Revisiting Symbolic Software-implemented Fault Injection Hoang Minh Le¹, Vladimir Herdt¹, Daniel Grosse² and Rolf Drechsler³ ¹Universität Bremen, DE; ²University of Bremen, DE; ³University of Bremen/DFKI GmbH, DE
14:35	W05.8.3	Constraining Graph-based Test Case Generation by Fitness Landscaping Stefan Mueller¹, Jo Laufenberg¹, Joachim Gerlach², Thomas Kropf¹ and Oliver Bringmann³ ¹University of Tuebingen, DE; ²Hochschule Albstadt-Sigmaringen, DE; ³Universität Tübingen, DE
14:55	W05.8.4	Closing the Gap Between FMEDA, FTA and Simulation Based Fault Injection at System Level Adam Himmelsbach¹, Sebastian Reiter¹, Alexander Viehl², Oliver Bringmann³ and Wolfgang Rosenstiel⁴ ¹FZI, DE; ²FZI Forschungszentrum Informatik, DE; ³Universität Tübingen, DE; ⁴University of Tübingen, DE
14:55	W05.9	Poster Discussions (Session III+V) & Refreshments
15:30	W05.10	Resilient Circuit Analysis
15:30	W05.10.1	Fault Injection Campaigns in Multi-Domain Virtual Prototypes Raghavendra Koppak¹, Oliver Bringmann² and Andreas von Schwerin³ ¹University of Tübingen / Siemens AG, DE; ²Universität Tübingen, DE; ³Siemens AG, DE
15:40	W05.10.2	Workload Dependent Aged Circuit Reliability Analysis Ajith Sivadasan¹, Armelle Notin¹, Vincent Huard¹, Etienne Maurin¹, Florian Cacho¹ and Lorena Anghel² ¹STMicroelectronics, FR; ²TIMA Laboratory, FR
15:50	W05.10.3	SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study Liang Wu¹, Saed Abughannam¹, Wolfgang Müller², Christoph Scheytt¹ and Wolfgang Ecker³ ¹Heinz Nixdorf Institute, DE; ²Universität Paderborn, DE; ³Infineon Technologies, DE
16:00	W05.10.4	Resilient Large-Scale Physical Design Roman Bazylevych¹ and Lubov Bazylevych² ¹Lviv Polytechnic National University, UA; ²Institute of Applied Problems of Mechanics and Mathematics NASU, UA
16:10	W05.11	Poster Discussions (Session VI)
16:45	W05.12	CLOSING

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W05 Second International Workshop on Resiliency in Embedded Electronic Systems (REES 2017)

Agenda

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