Conference

Printer-friendly versionPDF version

Register to get access to additional DATE services... read more here.

DATE 2013 - Call for Papers online

2012/06/01

DATE 2013 - Call for Papers

Grenoble, France
March 19 - 22, 2013

Download the CfP as PDF here (PDF - 520 kB)

Table of Content

Submission Deadlines

Submission Deadline
D, A, T and E papers Sunday, September 09, 2012 23:59:59 CET
Special Session proposals Sunday, September 09, 2012 23:59:59 CET
Tutorial proposals Sunday, September 09, 2012 23:59:59 CET
Friday Workshop proposals Sunday, September 09, 2012 23:59:59 CET
Exhibition Theatre Monday, October 22, 2012
PhD Forum Monday, November 05, 2012
Notification of acceptance Friday, November 16, 2012
Camera-ready paper due date Sunday, December 16, 2012
University Booth proposals Monday, January 21, 2013

The DATE 2013 conference and exhibition is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. It puts strong emphasis on ICs/SoCs, reconfigurable hardware and embedded systems, including embedded software.

The five-day event consists of a conference with plenary invited papers, regular papers, panels, hot-topic sessions, tutorials and workshops, two special focus days and a track for executives. The scientific conference is complemented by a commercial exhibition showing the state-of-the-art in design and test tools, methodologies, IP and design services, reconfigurable and other hardware platforms, embedded software, and (industrial) design experiences from different application domains, e.g. automotive, wireless, telecom and multimedia applications. The organisation of user group meetings, fringe meetings, a university booth, a PhD forum, vendor presentations and social events offers a wide variety of extra opportunities to meet and exchange information on relevant issues for the design and test community. Special space will also be allocated for EU-funded projects to show their results.

The Conference

The conference addresses all aspects of research into technologies for electronic and (embedded) systems engineering. It covers the design process, test, and tools for design automation of electronic products ranging from integrated circuits to distributed large-scale systems. This includes both hardware and embedded software design issues. The conference scope also includes the elaboration of design requirements and new architectures for challenging application fields such as telecom, wireless communications, multimedia and automotive systems. Persons involved in innovative industrial designs are particularly encouraged to submit papers to foster the feedback from design to research. Panels, hot-topic sessions and embedded tutorials highlight and inform about emerging topics.

Special Days in the programme will focus on two areas bringing new challenges to the system design community:

  • High-Performance Low-Power Computing
  • Electronic Technologies for Smart Cities

On the first day of the DATE event, half- and full-day in-depth technical tutorials are given by leading experts in their respective fields. The tutorials are well suited for researchers, tool developers and system designers.

Friday Workshops concentrate on specialised and novel topics.

The Exhibition

The conference is complemented a large exhibition and unique networking opportunity for vendors of tools and services for hardware and embedded software for the design, development and test of Systems-on-Chip, IPs, Embedded Systems, ASICs, FPGAs and PCBs including a broad range of design reuse technologies and services. To inform attendees on commercial and design related topics, there will be a full programme in the Exhibition Theatre which will combine presentations by exhibiting companies and selected conference special sessions.

Topic Areas for Submission

Within the scope of the conference, the main areas of interest are organised in the following tracks. Submissions can be made to any of the track topics. For detailed descriptions of the track topics, please refer to the DATE Web site at https://www.date-conference.com/group/tpc/members.

Track D: Design, Methods and Tools, addressing design automation and design tools for electronic and embedded systems. Emphasis is on methods and tools related to the use of computers in designing products. This includes designer feedback on existing design methods and tools as well as to initiate discussions on requirements of future system architectures, design flows and environments.

This track is organised in the following topics:

Track A: Application Design, is devoted to the presentation and discussion of design experiences with a high degree of industrial relevance, as well as innovative design methodologies and applications of specific design technologies. Contributions should illustrate state-of-the-art or record breaking designs, which will provide viable solutions in tomorrow's silicon and embedded systems. In topic A7, there is the opportunity to submit short, 2-page papers, that relate to industrial research and practice.

This track is organised in the following topics:

Track T: Test and Reliability, addressing design-oriented embedded test solutions as well as defect analysis, modeling, test generation and silicon debugging. Emphasis is on both system- and chip-level test.

This track is organised in the following topics:

Track E: Embedded Systems Software, is devoted to modeling, analysis, design and deployment of Embedded Software. Areas of interest include methods, tools, methodologies and development environments. Emphasis will also be on embedded software platforms, software integration, adaptive real-time systems, and dependable systems.

This track is organised in the following topics:

In addition to the above conference tracks, we welcome proposals for Special Sessions, Tutorials and Friday Workshops, and submissions for the Special Days on High-Performance Low-Power Computing and Electronic Technologies for Smart Cities.

Committees

A full list of the executive and programme committee members is available on the DATE Web site.

Sponsors

The event is sponsored by the European Design and Automation Association, the EDA Consortium, the IEEE Council on EDA, ECSI, ACM - SIGDA, and RAS. In cooperation with ACM – SIGBED, IEEE Solid-State Circuits Society (SSCS), IFIP, IET, and TTTC.

Information

Conference Manager
Sue Menzies, European Conferences, UK
conference-managementatdate-conference [dot] com
phone: +44 131 225-2892
fax: +49 511 8090-4962

General Chair
Enrico Macii, Politecnico di Torino, IT
Contact Enrico Macii

Programme Chair
Erik Jan Marinissen, IMEC, BE
Contact Erik Jan Marinissen

To add your name to the mailing list, please register at the DATE Web site: https://www.date-conference.com/user/register/

Submission Instructions

Please have a look at the detailed submission instructions at https://www.date-conference.com/submission-instructions

Pictures of the DATE 2013 Conference

2013/03/28

DATE 2013 Opening CommitteeDATE 2013 Opening - Major of the city of GrenobleDATE 2013 Opening Audience

You will find more conference pictures in the DATE Gallery.

DATE Best Paper Awards

2013/03/19

The DATE 2012 best paper is:

COMPOSITIONAL SYSTEM-LEVEL DESIGN EXPLORATION WITH PLANNING OF HIGH-LEVEL SYNTHESIS
Hung-Yi Liu, Michele Petracca, and Luca P. Carloni, Columbia University, US.

The DATE 2013 best papers are:

D Track

AVICA: AN ACCESS-TIME VARIATION INSENSITIVE L1 CACHE ARCHITECTURE
Seokin Hong and Soontea Kim - Korea Advanced Institute of Science and Technology, KR

A Track

SCC THERMAL MODEL IDENTIFICATION VIA ADVANCED BIAS-COMPENSATED LEAST-SQUARES
Roberto Diversi, Andrea Bartolini, Andrea Tilli, Francesco Beneventi and Luca Benini - University of Bologna, IT

T Track:

HANDLING DISCONTINUOUS EFFECTS IN MODELING SPATIAL CORRELATION OF WAFER-LEVEL ANALOG/RF TESTS
Ke Huang and Yiorgos Makris - University of Texas at Dallas, US

and

Nathan Kupp - Yale University, US

and

John Carulli - Texas Instruments, US

E Track

FIFO CACHE ANALYSIS FOR WCET ESTIMATION: A QUANTITATIVE APPROACH
Nan Guan, Xinping Yang and Wang Yi - Uppsala University, SE

and

Mingsong Lv - Northeastern University, CN

Congratulations to the winners!

First pictures of DATE 2013 Opening and Keynotes

2013/03/20

DATE 2013 Opening CommitteeDATE 2013 Opening - Major of the city of GrenobleDATE 2013 Opening Audience

You will find more pictures in the DATE Gallery.

DATE 2014 in Dresden, Germany - Preliminary Call for Papers available

2013/03/19

DATE 2014 will take place again at the ICC in Dresden, Germany March 24-28, 2014. The preliminary Call for papers is now availabe for download here (PDF, 144 kB).

The 2013 event highlights High-Performance Low-Power Computing and Electronic Technologies for Smart Cities

2013/02/28

Exhibition

The DATE Exhibition is once again the premier European event for industrial professionals and academics alike. This exhibition will feature suppliers of development tools and platforms for hardware and software development, showing a range of products from the front-end to back-end chip design through to silicon test and manufacture, from system architecture through to embedded software implementation and networking. Grenoble’s leadership in microelectronics will be highlighted by Minalogic and Grenoble-Isère/AEPI with a cluster of 10 local leading companies.

The 2013 Exhibition will run for three days (Tuesday 19 – Thursday 21 inclusive) and take place on the ground floor, adjacent to the main entrance and registration desks.

Exhibitors' profiles are available at:

https://www.date-conference.com/exhibitors-sponsors

Exhibition Theatre features Hot Topics, best practice and panels

As special feature for exhibition visitors offers three days of high-quality program free of charge in the Exhibition Theatre. Located in the midst of the exhibition area, the Exhibition Theatre program provides best practice on design for various fields of applications and a special selection of the conference program with special Hot Topics, Tutorials and Panel sessions with industry leaders. At DATE 2013 the partnering regions of Silicon Saxony, DSP Valley, Minalogic and High Tech NL will present in the Exhibition Theatre their work and the goals they want to achieve. These four of the leading European micro- and nano-electronics regions recently began to join their research, development and production expertise to form the transnational, research-driven cluster Silicon Europe, actually one of the largest technology clusters of the world.

All sessions can be attended with a free-of-charge exhibition registration, a conference registration is not required.

Detailed information on the Exhibition Theatre sessions is available at:

https://www.date-conference.com/group/exhibition/exhibition-theatre

University Booth

Another hot-spot in the exhibition is the University Booth where the leading universities and research institutes will present their latest research results with hardware and software demonstrators.

With 11 sessions and 9 presentations running in parallel, the University Booth is a unique place showcasing a vast bunch of innovations covering EDA, design and test which will shape and revolutionize the way we design products in the future.

DATE 2013 will be at the Alpexpo Conference Center in Grenoble

Located in the heart of the Alps and surrounded by the outstanding natural beauty of the Belledonne, Chartreuse and Vercors massifs, Grenoble is the key semiconductor site in Europe with more than 38,000 people in micro- and nano-technologies (24000) and embedded software (14000). Grenoble provides the second largest research site in France with 15 research centres and universities. There are some 100 start-up companies located in the area in addition to 117 companies – 81% of which are SMEs. Minatec is a centre for innovation for micro- and nano-technology and contributes to the reputation of Grenoble as one of Europe’s key scientific centres. Alpexpo Conference Center is located in close proximity to central Grenoble and provides a modern, well-equipped location for DATE. It is one of Europe’s most prestigious venues for economic, cultural and sporting events.

Alpexpo is a 15-minute tram ride from the centre of Grenoble. Information on hotel bookings at:

https://www.date-conference.com/location

DATE 2013 Press Contacts

General Chair__

__DEC_Contact_Programme Chair__

__DEC_Contact_Press Chair__

__DEC_Contact_Exhibition Theatre Chair__

__DEC_Contact_Exhibition Chair__

__DEC_Contact_Local Liasion__

__DEC_Contact_Event Secretariat

DATE 2013 Announces Availability of the Advance Program

2013/01/18

About 200 papers have been selected from over 1,000 submissions for regular presentations in 57 sessions, allowing top researchers from all over the world to present their most important and recent research findings in tracks D (Design methods, tools, algorithms and languages), A (Applications), T (Test & Reliability), and E (Embedded systems).

DATE’s technical session program will be supplemented by 15 Special Sessions including five Embedded Tutorials [1], seven Hot-Topic Sessions [2] and three Panels [3].

Extra tracks will be dedicated to two Special Days:

High-Performance Low-Power Computing [4] on Wednesday, March 20, and Electronic Technologies for Smart Cities [5] on Thursday, March 21.

Each special day will have a full program of keynotes, panels, tutorials and technical presentations.

From Tuesday to Thursday, about 100 Interactive Presentations organized into five IP Sessions in a face-to-face discussion area will contribute to scientific interactions on emerging and open problems on Design, Verification, and Test.

In addition, DATE 2013 will organize an Exhibition Theatre [6] program that will provide a mix of panel discussions and user presentations giving exhibition visitors and conference delegates a dynamic overview of key technical and business issues in electronic and embedded systems design.

To complement the regular conference program, the DATE Friday’s Workshops initiative [7] will offer workshops on current and emerging important issues in design, test, EDA, and software.


Detailed Descriptions

[1] Embedded Tutorials

  • Reliability Analysis Reloaded: How Will We Survive?
  • On the Use of GP-GPUs for Accelerating Computing Intensive EDA Applications
  • Advances in Asynchronous Logic: from Principles to GALS & NoC, Recent Industry Applications, and Commercial CAD Tools
  • From Multi-core SoC to Scale Out Processors
  • Closed-Loop Control for Power and Thermal Management in Multi-core Processors

[2] Hot Topic Sessions

  • IP Subsystems: The Next Productivity Wave?
  • Design for Variability, Manufacturability, Reliability, and Debug: Many Faces of the Same Coin?
  • Security Challenges in Automotive Hardware/Software Architecture Design
  • Emerging Nanoscale Devices: A Booster for High Performance Computing
  • Energy-Efficient Design and Test Techniques for Future Multi-Core Systems
  • Countering Counterfeit Attacks on Micro-Electronics
  • Reliability Challenges of Real-time Systems in Forthcoming Technology Nodes

[3] Panels

  • The Heritage of Mead & Conway: What Has Remained the Same, What Was Missed, What Has Changed, What Lies Ahead
  • Will 3D-IC Remain a Technology of the Future… Even in the Future?
  • Can Energy Harvesting Deliver Enough Power for Automotive Electronics?

[4] Special Day 1: High-Performance Low-Power Computing

This Special Day will feature four sessions covering System, IC Architecture, Many-Core SoC and Fabrication Technology Approaches for Energy-Efficiency. As precisely noted by the Special Day Chair, Dr. A. Jerraya from CEA-LETI, “The environmental pressure is generating stringent constraints on computing systems where energy-efficiency needs to be improved by a factor 50 in the next five years. To reach this goal, system and architecture solutions need to be aligned with circuit and fabrication process solutions”. This event will be held on Wednesday, March 20.

[5] Special Day 2: Electronic Technologies for Smart Cities

This Special Day will provide a technical insight on several electronic technologies, which are at the basis of the Smart Cities of the future. “The term Smart City has been a buzz-word in the last couple of years, especially in Europe, and significant investments have been made by public authorities, locally and internationally, to promote, define and implement the concept. A city can be made “smart” in several ways, most of which can be combined: mobility, health-care, energy efficiency, services to the citizens and so forth represent challenges that a smart city must face”. “Electronic devices, circuits, systems and software constitute the enabling technologies for implementing the aforementioned applications”, states Prof. Enrico Macii from Politecnico di Torino, Chair of the Electronic Technologies for Smart Cities Special Day. This event will be held on Thursday, March 21.

[6] Exhibition Theatre

The Exhibition Theatre program will host a series of discussions to provide a broad view on the technical and business challenges in current and future design practices. Industrial testimonials will offer engineers an insight into good working practices and current design methods on topics like Power Integrity Verification, Data Management and Memory Architectures in Many-core SoCs, and Optimization of Analog Designs. Also, the use of 3D-IC Technology today and in the future will be discussed by a panel in the Exhibition Theatre. Highlighting a major step in joining forces at European Level, the Silicon Europe initiative will present a panel session on the available competences in already existing clusters in Dresden, Eindhoven, Grenoble, and Leuven and will give an outlook on how they want to make a major step forward by close co-operation.

[7] Friday's Workshops

The Friday's Workshops program includes nine workshop themes, ranging from embedded systems to 3D integration. Three workshops focused on broad embedded systems field are: Embedded Parallel Computing Platforms, Platform 2012/STHORM Embedded Many Cores Accelerations, and Reconfigurable Computing. One workshop is focused on methods for system-level design, in particular on the Integration of SystemC Design and Verification with AMS and Algorithm Design. 3D Integration workshop, building on the success from the previous four years, covers a broad spectrum of topics from technology and test to chip package and board co-design challenges. Two workshops discuss the lessons learned from large multi-institutional research programs for attendees interested in the Reliability and Resilient Design Through Software Approaches. For the first time at DATE, the workshop entitled Neuromorphic and Brain-Based Computing Systems is proposed to discuss new/emerging areas relevant to the electronic design automation community. Finally, a workshop focusing on Industry-Driven Approaches for Cost-effective Certification of Safety-Critical, Mixed-Criticality Systems (WICERT) aims at gathering a strong industrial community to discuss and evaluate new HW/SW architectures, mechanisms and safety guidelines to achieve a more cost-effective, precise, and scalable certification.

For further information please visit the DATE Web site from January 2013

www.date-conference.com

DATE 2013 Press Contacts

General Chair__

__DEC_Contact_Programme Chair__

__DEC_Contact_Press Chair__

__DEC_Contact_Exhibition Theatre Chair__

__DEC_Contact_Exhibition Chair__

__DEC_Contact_Local Liasion__

__DEC_Contact_Event Secretariat

 

Syndicate content