University Booth

University Booth

Contact: Andreas Vörg, edacentrum, DE and Jens Lienig, Technische Universität Dresden, DE


edacentrum
Schneiderberg 32
Hannover, NI 30167
Germany

Technische Universität Dresden
Helmholtzstr. 10
Dresden, SN 01069
Germany

Tel: +49 511 762 19686 (Andreas Vörg)
Fax: +49 511 762-19695 (Andreas Vörg)

University Booth logo

E-Mail: university-booth@date-conference.com
Website: https://www.date-conference.com/exhibition/u-booth

The University Booth fosters the transfer of academic work to industry. The University Booth is part of the DATE 2018 exhibition and is free of charge for presenters and their visitors. The University Booth is sponsored by the DATE Sponsor's Committee. The University Booth will be organized for EDA software and hardware demonstrations. Universities and public research institutes are invited to present innovative hardware and software demonstrations. All demonstrations will be hosted in the DATE exhibition area, within a dedicated time slot.

Research institutes and universities interested in demonstrating their mature prototypes and pre-commercial results can find submission details at https://www.date-conference.com/exhibition/u-booth. Submission deadline is Sunday, January 14, 2018 23:59:59 CET.

The University Booth is organized by the University Booth Co-Chairs
Jens Lienig, Technische Universität Dresden, DE
university-booth at date-conference [dot] com
Andreas Vörg, edacentrum GmbH, DE
university-booth at date-conference [dot] com.




ASIC and SOC Design:

  • Design Entry
  • Behavioural Modelling & Simulation
  • Synthesis
  • Power & Optimisation
  • Physical Analysis (Timing, Themal, Signal)
  • Verification
  • Analogue and Mixed-Signal Design
  • MEMS Design
  • RF Design

System-Level Design:

  • Behavioural Modelling & Analysis
  • Physical Analysis
  • Acceleration & Emulation
  • Hardware/Software Co-Design
  • Package Design
  • PCB & MCM Design

Test:

  • Design for Test
  • Design for Manufacture and Yield
  • Logic Analysis
  • Test Automation (ATPG, BIST)
  • Boundary Scan
  • Silicon Validation
  • Mixed-Signal Test
  • System Test

Services:

  • Design Consultancy
  • Prototyping
  • Data Management and Collaboration
  • IP e-commerce & Exchange
  • Foundry & Manufacturing
  • Training

Embedded Software Development:

  • Compilers
  • Real Time Operating Systems
  • Debuggers
  • Software/Modelling

Hardware:

  • FPGA & Reconfigurable Platforms
  • Development Boards
  • Workstations & IT Infrastructure

Semiconductor IP:

  • Analogue & Mixed Signal IP
  • Configurable Logic IP
  • CPUs & Controllers
  • Embedded FPGA
  • Embedded Software IP
  • Encryption IP
  • Memory IP
  • On-Chip Bus Interconnect
  • On-Chip Debug
  • Physical Libraries
  • Processor Platforms
  • Synthesizable Libraries
  • Test IP
  • Verification IO

Application-Specific IP:

  • Analogue & Mixed Signal IP
  • Data Communication
  • Digital Signal Processing
  • Multimedia Graphics
  • Networking
  • Security
  • Telecommunication
  • Wireless Communication