DATE 2022 fully virtual event

DATE 2022: fully virtual event -- ONSITE days moved ONLINE

We have been planning a special format for DATE 2022, aiming at bringing back the community together after two editions online, trying to balance the uncertainty of the situation and the desire to be partially back in presence. A special program has been organized to start the conference with two days in presence, full of outstanding talks and moments to meet and chat.
However, the current situation of the covid-19 infections across Europe and the consequent travelling/quarantine restrictions adopted by governments, companies and institutions have a strong impact on our health concerns and travelling opportunities, for speakers as well as attendees.
The "in presence" experience remains a fundamental aspect of any conference and of DATE in the specific, for its many networking moments, as well as for the social activities, however the safety of the community is once more a priority. Therefore, after thoughtfull discussion, the DATE Steering Committee opted to move DATE 2022 to a completely virtual event, moving the program of the first two days online also.

Although there is no way to mitigate the disappointment of not being able to meet in person, we trust the rich and interesting program will bring us together online to comment and contribute to the exciting talks and conversations with the speakers and authors of full DATE 2022 program.

Joint Electrocic Roadmap for innovations in the automobile value chain!

Project Acronym
Project Type
nationally-funded project, funded by the German Federal Ministry of Research and Education, Funding Label: 16ES0865-16ES0876
Project Dates
Contact Person
Berthold Hellenthal, Audi AG,

1. What makes the project concept unique?

The GENIAL! Project targets the organization of innovations in complex value chains, in particular in the automotive domain, from semiconductor manufacturer up to OEM. Existing modeling languages, tools and methods for systems engineering focus on a concrete development process. GENIAL! extends their scope by a temporal dimension for estimation of performances and planning innovations in the mid- and long-term future.

For this purpose, GENIAL develops:

  • A cloud-based repository of functions, performances, and its future availability and means for consistency checking and constraint propagation (AGILA).
  • A modeling language (SysMD, leaning towards SysML v2 textual) with low entry-hurdle that permits contributions from different domains.
  • A graphical frontend (IRIS) for interactive analysis, exploration of the innovation-space, and collaborative planning of innovations.

2. What project outcomes can be of use to the DATE 2022 community?

The project outcomes are at one hand the above-mentioned tools and processes for analyzing future innovations in the value chain. At the other hand, concrete libraries and roadmaps targeting the automotive and microelectronic domain are expected outcomes in the next two years. While the libraries target simplifying the analysis, the roadmaps are agreed and public results that answer important questions such as which innovations at the (functional) level of an OEM are expected in the future, which enabling technologies from the semiconductor side are expected, and how these interact.

3. What inputs (solutions) are expected from the DATE 2022 community?

The GENIAL! project aims at feedback from the DATE 2022 community regarding the feasibility of the GENIAL! Approach in order to further improve the projects’s outcome. Furthermore GENIAL! is open for further contributors.

4. What new research topics and trends the project introduces?

GENIAL! introduces for the first time means (processes, tools) for the systematic long-term collaboration and planning of innovations in a complex value-chain.

Project partners:

  • Eberhard Karls Universität Tübingen, DE
  • edacentrum GmbH, DE
  • HELLA GmbH & Co. KGaA, DE
  • Infineon Technologies AG, DE
  • OFFIS - Institut für Informatik, DE
  • Prozesswerk GmbH, DE
  • Robert Bosch GmbH, DE
  • Technische Universität Kaiserslautern, DE
  • Universität Ulm, DE

Associated partners

  • Cadence Design Systems GmbH
  • Continental Automotive GmbH
  • Dream Chip Technologies GmbH
  • Fujikura Technology Europe GmbH
  • Globalfoundries Europe Ltd.
  • HOOD GmbH
  • Intel Deutschland GmbH
  • Microchip Technology
  • NXP Semiconductors Germany GmbH
  • Siemens AG
  • SIL System Integration Laboratory GmbH
  • Synopsys GmbH
  • System Integration Laboratory GmbH
  • Volkswagen AG