Progress on Carbon Nanotube BEOL Interconnects
B. Uhlig1, J. Liang8, J. Lee4, R. Ramos2, A. Dhavamani1, N. Nagy1, J. Dijon2, H. Okuno3, D. Kalita3, V. Georgiev4, A. Asenov4,5, S. Amoroso5, L. Wang5, C. Millar 5, F. Konemann6, B. Gotsmann6, G. Goncalves7, B. Chen7, R. R. Pandey8, R. Chen8 and A. Todri‐Sanial8
1Fraunhofer IPMS, Dresden, Germany
2CEA‐LITEN/University Grenoble Alpes, France
3CEA‐INAC/University Grenoble Alpes, France
4School of Engineering, University of Glasgow, UK
5Synopsys Inc., Glasgow, UK
6IBM Research Zurich, Switzerland
7Aixtron Ltd., UK
8CNRS‐LIRMM/University of Montpellier, France
ABSTRACT
This article is a review of the current progress and results obtained in the European H2020 CONNECT project. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) process & growth of carbon nanotube interconnects compatible with back‐end‐of‐line integration, 2) modeling and simulation from atomistic to circuit‐level benchmarking and performance prediction, and 3) characterization and electrical measurements. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a review and informative cornerstone on carbon nanotube interconnects.
Keywords: Carbon nanotubes, Interconnects.
