DATE 2021 became a virtual conference due to the worldwide COVID-19 pandemic (click here for more details)

Taking into consideration the continued erratic development of the worldwide COVID-19 pandemic and the accompanying restrictions of worldwide travelling as well as the safety and health of the DATE community, the Organizing Committees decided to host DATE 2021 as a virtual conference in early February 2021. Unfortunately, the current situation does not allow a face-to-face conference in Grenoble, France.

The Organizing Committees are working intensively to create a virtual conference that gives as much of a real conference atmosphere as possible.

1.8.1 Enabling Early and Fast Thermal Simulation for 3D Multi-Die System Designs

Start
08:50
End
09:15
Speaker
Iyad Rayane, Zuken, France
Co-Author
Koga Kazunari, Zuken, France

As design complexity increases with 3DICs and time-to-market becomes a critical component in the automotive, wearables and IoT segments, reducing design cycle time while maintaining accuracy of analysis has become all the more important. To address this, a system level co-design approach in step with multi-physics analysis is presented. To mitigate errors due to manual exchange of data between various engineering teams spread across chip, package and board with design and analysis adding further level of exchange, a design flow incorporating simplification at the layout level is shown. The flow enables various levels of simplified models to be used, wherein data transfer between the complex 3D structures in layout to the thermal analysis tool is automated. The efficacy of the model simplification is verified through a test case showing comparable results for the simplified and full models.