In preparations for DATE 2021, the Organizing Committees will continue to closely monitor the development of the worldwide Covid-19 situation and adjust the conference format accordingly. Updated information will always be available on this page.

W09.2.2 Benefits of 3D stacking process for Event Based sensors

Start
09:20
End
09:40
  • About the talk: 3D stacking processes are very suitable for Image sensor with complex pixel structure composed of many components. During the talk, we will discuss the unique nature of event based sensor and the trade offs to optimize their design using  3D Stacking process. Long-term evolutions of the 3D integration for intelligent image sensor will also be discussed.
  • About the speaker: Jean-Luc Jaffard has been graduated from Ecole Supérieure d’Electricité of Paris in 1979. From 1980 to 1996 he occupied various R&D management positions in consumer division of SGS Thomson Microelectronics (initially Thomson Semiconductor)  From 1996 Jean-Luc Jaffard paved the way of imaging activity at STMicroelectronics being at the forefront of the emergence and growth   of this business. At STMicroelectronics Imaging Division he was successively appointed Research Development and Innovation Director and later on promoted Deputy General Manager. In 2010 he was appointed STMicroelectronics Intellectual Property Business Unit Director. In 2014 he created the Technology and Innovation branch of Red Belt Conseil, bringing expertise in optimisation of complex and innovative solutions to develop competitive products. From 2014 he has been acting as SEMI Europe Imaging conference Chairman. In 2016 he joined Prophesee, French start-up developing biomorphic sensor and processing technology as VP Hardware