Taking into consideration the continued erratic development of the worldwide COVID-19 pandemic and the accompanying restrictions of worldwide travelling as well as the safety and health of the DATE community, the Organising Committees decided to host DATE 2021 as a virtual conference in early February 2021. Unfortunately, the current situation does not allow a face-to-face conference in Grenoble, France.

The Organising Committees are working intensively to create a virtual conference that gives as much of a real conference atmosphere as possible.

ET4.8.3 Quick decision of System In Package implementation for IoT/5G era

Start
18:00
End
18:30

The increasing complexity of system on chips (SoCs) combined with a new generation of designs that combine multiple chips in a single package (Sip) is creating new challenges in the design of IC packages, printed circuit boards (PCBs) and integrated circuits (ICs). The process typically involves three independent design processes – chip, package and PCB – carried out with point tools whose interface requires time-consuming manual processes that are error-prone and limit the potential for reuse. This challenge is being addressed by a new integrated 3D chip/package/board co-design environment that makes it possible to take quick decision of the best SiP implementation by considering the system-level impact of each design decision, especially for optimizing. The new co-design approach enables netlist management to follow up design modification including die partitioning and seamless electrical characteristic verification during the design. The end result is higher performance and improved quality for smart systems, MEMS and IoT applications.