DATE 2021 became a virtual conference due to the worldwide COVID-19 pandemic (click here for more details)

Taking into consideration the continued erratic development of the worldwide COVID-19 pandemic and the accompanying restrictions of worldwide travelling as well as the safety and health of the DATE community, the Organizing Committees decided to host DATE 2021 as a virtual conference in early February 2021. Unfortunately, the current situation does not allow a face-to-face conference in Grenoble, France.

The Organizing Committees are working intensively to create a virtual conference that gives as much of a real conference atmosphere as possible.


ET6.8.3 Connecting Design, Manufacturing and Assembly in the Moore’s Law 2.0 Era

Paul Cohen, SEMI/ESDA, United States

As device scaling predicted by Moore’s Law becomes more difficult and costly, designers are looking towards new solutions to deliver increasing system level functionality and performance along with lower power and cost. The International Technology Roadmap for Semiconductors (ITRS) served as a designer’s guide to upcoming technologies for many years until it’s retirement in 2016. The Heterogeneous Integration Roadmap (HIR) provides a new guideline for system level integration for the coming decades. This includes new technologies which will have an impact on the tradeoffs facing designers. In addition, the increasing use of silicon in products and applications with long lifetimes and critical safety requirements suggests that long term process effects can no longer be safely ignored. All of this requires increased communication amongst all aspects of system design, manufacture, and assembly as we move towards Moore 2.0.