Technical Programme Committee 2017

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Topic: D9 Temperature and Variability Aware System Design and Optimization

Methods, techniques and architectures for counteracting variability of digital circuits and systems due to manufacturing, thermal or aging effects; design and run-time thermal, variability and reliability management of SoCs and multi-core platforms (both at hardware and software level); modeling and optimization approaches for manufacturing and temperature variations and degradation mechanisms in emerging 3D integration and manufacturing technologies.

Chair: Giovanni Ansaloni, University of Lugano, CH, Contact Giovanni Ansaloni

Co-Chair: Jose L. Ayala, Complutense University of Madrid, ES, Contact Jose L. Ayala

Members: