Embedded Systems Initiative (ESI)

Embedded Systems Initiative (ESI)

Contact: Dr. - Ing. Torsten Klie


Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU)/ Interdisziplinäres Zentrum für Eingebettete Systeme (ESI)
Martensstraße 3
91058 Erlangen
Germany

Tel: +49 9131 85-25151
Fax: +49 9131 85-25144


E-Mail: info@esi.uni-erlangen.de
Website: http://www.esi-anwendungszentrum.de

The Interdisciplinary Centre for Embedded Systems (ESI) combines the expertise in all aspects related to embedded systems design of currently 15 departments of the Friedrich-Alexander-Universität Erlangen-Nürnberg. ESI functions as a central point of contact for cooperation between companies and research institutes of the FAU Erlangen-Nürnberg, allowing  to offer diverse and special expertise in cooperation with companies of various sectors. ESI functions as a central point of contact for cooperation between companies and research institutes of the FAU Erlangen-Nürnberg in the Emdedded Systems Domain.

Along with basic research, practical user knowledge is essential to successfully developed  embedded systems. The Fraunhofer Institute for Integrated Circuits (IIS) is well-known for its knowledge in applied research. The ESI Application Centre builds a bridge between basic research of the FAU and applied research knowledge of the Fraunhofer IIS to master the complexity of future research and innovations.  Our research topics are bundled in the ESI Application Centre in three Labs:

Automation@ESI (Industrial Automation, Industry 4.0)
Automotive@ESI (Sensors and driver assistence systems)
Fitness@ESI (wireless sensors and training assistence)

The ESI Application Centre offers:
•    Interdisciplinary solutions focused on your needs
•    Independent development, evaluation and implementation of Embedded Systems according to your specifications
•    Many years of research experience and successfully concluded research projects as well as effective cooperations
•    Scientific know-how especially in the following areas:
◦    Multicore Systems
◦    Design Methods, especially Hardware-Software-Co-Design
◦    Wireless Communication and Localisation
◦    Integrated Sensors
◦    Machine Learning, Pattern Analysis and Image and Data Processing




Services:

  • Design Consultancy
  • Prototyping