Topic: D9 Temperature and Variability Aware System Design and Optimization

Methods, techniques and architectures for counteracting variability of digital circuits and systems due to manufacturing, thermal or aging effects; design and run-time thermal, variability and reliability management of SoCs and multi-core platforms (both at hardware and software level); modeling and optimization approaches for manufacturing and temperature variations and degradation mechanisms in emerging 3D integration and manufacturing technologies.

Chair: Giovanni Ansaloni, University of Lugano, CH, Contact

Co-Chair: Jose L. Ayala, Complutense University of Madrid, ES, Contact

Members:

• Giovanni Beltrame, École Polytehcnique de Montréal, CA, Contact
• Siddharth Garg, New York University, US, Contact
• Timothy Jones, University of Cambridge, GB, Contact
• Georgios Karakonstantis, Queen's University Belfast, GB, Contact
• Hiroki Matsutani, Keio University, JP, Contact
• Seda Memik, Northwestern University, US, Contact
• Mohamed Sabry, Stanford, US, Contact
• Rene van Leuken, TU Delft, NL, Contact
• Pieter Weckx, IMEC vzw, BE, Contact
• Kai-Chiang Wu, National Chiao Tung University, ES, Contact