Technical Programme Committee 2016

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Topic: T2 Test Generation, Simulation and Diagnosis

Test pattern generation (TPG); fault simulation; system test; test coverage metrics and estimation; adaptive test; self-healing/self-calibration/self-adaptation; diagnosis; debug; post-silicon validation; testing at various levels of a system: embedded core, System-on-Chip, System-in-Package, 3D chips; hardware/software system test; processor based test.

Chair: Bernd Becker, University of Freiburg, DE, Contact

Co-Chair: Wu-Tung Cheng, Mentor Graphics, US, Contact

Members:

  • Jacob Abraham, University of Texas at Austin, US, Contact
  • Piet Engelke, Infineon, DE, Contact
  • Huawei Li, Institute of Computing Technology, CAS, CN, Contact
  • Nicola Nicolici, McMaster University, CA, Contact
  • matteo sonza reorda, politecnico di torino - DAUIN, IT, Contact
  • Xiaoqing Wen, Kyushu Institute of Technology, JP, Contact