High Performance Center Functional Integration in Micro- and Nanoelectronics

High Performance Center Functional Integration in Micro- and Nanoelectronics (Booth: Campus 3D)

Contact: Mario Walther


Leistungszentrum MikroNano
Maria-Reiche-Str. 2
01109 Dresden
Germany

Tel: +49 351 8823 354
Fax: +49 351 8823 222

High Performance Center Functional Integration in Micro- and Nanoelectronics

E-Mail: LZ-MikroNano@fraunhofer.de
Website:

High Performance Center Functional Integration in Micro- and Nanoelectronics

In Dresden Germany, the European hot spot of microelectronics, a new network of research organizations and the industry has been established.

Core research partners are the Technical University Dresden, the Technical University Chemnitz, the University of Applied Sciences Dresden and the Fraunhofer Institutes IPMS, ENAS, IIS-EAS and IZM-ASSID.

They started a program for development of new microelectronics components. In a cooperation network they combine system design and modelling,

innovative materials for new components and processes with heterogeneous system integration and reliability characterization.

Piezo electronic materials, magnetic layer structures, nano optical layers and Li based thin on chip layers for energy storage are part of the program.

The partners offer their joint developments and capabilities for industrial partner to establish collaboration programs.

Partners:

  • Fraunhofer-Institut für Photonische Mikrosysteme IPMS / Fraunhofer Institute for Photonic Microsystems IPMS
  • Fraunhofer-Institut für Elektronische Nanosysteme ENAS / Fraunhofer Institute for Electronic Nano Systems
  • Fraunhofer-Institut für Integrierte Schaltungen IIS / Fraunhofer Institute for Integrated Circuits IIS (Institutsteil Entwurfsautomatisierung EAS / Design Automation Division EAS)
  • Fraunhofer IZM- All Silicon System Integration Dresden (ASSID)
  • Technische Universität Dresden
  • Technische Universität Chemnitz
  • Hochschule für Technik und Wirtschaft Dresden
  • Hochschule Mittweida




ASIC and SOC Design:

  • Design Entry
  • Behavioural Modelling & Simulation
  • Physical Analysis (Timing, Themal, Signal)
  • Analogue and Mixed-Signal Design

System-Level Design:

  • Behavioural Modelling & Analysis
  • Physical Analysis
  • Package Design

Test:

  • Design for Test
  • Design for Manufacture and Yield
  • Silicon Validation
  • Mixed-Signal Test
  • System Test

Services:

  • Design Consultancy
  • Prototyping
  • Foundry & Manufacturing

Embedded Software Development:

  • Software/Modelling

Semiconductor IP:

  • Analogue & Mixed Signal IP
  • Embedded Software IP
  • Physical Libraries
  • Synthesizable Libraries

Application-Specific IP:

  • Analogue & Mixed Signal IP