Technical Programme Committee 2014

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Topic: T3 Test for Mixed-Signal, Analog, RF, MEMS/bioMEMS/MOEMS

Test generation; test instrumentation; built-in test; built-in self-test; design-for test; defect characterization; failure analysis; fault modeling; fault simulation; defect-oriented test; test coverage metrics and estimation; adaptive test; self-healing/self-calibration/self-adaptation; design-for-manufacturability and design-for-yield; diagnosis and self-repair; test economics.

Chair: haralampos [dot] stratigopoulos at lip6 [dot] fr, Contact

Co-Chair: Andre Ivanov, UBC, CA, Contact

Members:

  • Abhijit Chatterjee, Georgia Tech, US, Contact
  • Hans Kerkhoff, University of Twente, NL, Contact
  • Gildas Leger, IMSE-CNM-CSIC, ES, Contact