Topic: T1 Defects, Faults, Variability and Reliability Analysis and Modeling

Identification, characterization and modeling of defects, faults and degradation mechanisms; defect-based fault analysis; reliability analysis and modeling, Failure mode and effect analysis (FMEA) and physics of failures; noise and uncertainty modeling; test and reliability issues in emerging technologies; modeling and mitigation of physical sources of errors such as process, voltage, temperature and aging variations; process yield modeling and enhancement.

Chair: Robert Aitken, ARM, US, Contact

Co-Chair: Joan Figueras, Universitat Politècnica Catalunya, ES, Contact

Members:

• Kanak Agarwal, IBM Corp, US, Contact
• Bartomeu Alorda, Illes Balears University, ES, Contact
• Sandeep Gupta, University of Southern California, US, Contact
• Bram Kruseman, NXP Semiconductors, NL, Contact
• Kuen-Jong Lee, National Cheng Kung University, TW, Contact
• Irith Pomeranz, Purdue University, US, Contact
• Rosa Rodriguez, UPC, ES, Contact
• Markus Rudack, Intel Mobile Communications GmbH, DE, Contact
• Medhi Tahoori, KIT, DE, Contact
• Li Wang, UC Santa Barbara, US, Contact