Topic: T1 Test for Defects, Variability, and Reliability

Identification, characterization and modeling of defects, faults and degradation mechanisms; defect-based fault analysis, simulation and ATPG of defect-based faults; reliability analysis and modeling techniques, FMEA and physics of failure; test for noise and uncertainty; design-for-reliability and design-for-variability and their impact on test; test and reliability of redundant systems; test and reliability issues in the presence of leakage; challenges of ultra low-power design on test and reliability; modeling and test techniques for physical sources of errors such as process, voltage and temperature variations; error-resilient nano-design systems.

Chair: Bram Kruseman, NXP Semiconductors, NL, Contact

Co-Chair: Jaume Segura, Universitat de les Illes Balears, ES, Contact

Members:

• Kanak Agarwal, IBM Corp, US, Contact
• Robert Aitken, ARM, US, Contact
• Sandeep Gupta, University of Southern California, US, Contact
• Kuen-Jong Lee, National Cheng Kung University, TW, Contact
• Markus Rudack, Intel Mobile Communications GmbH, DE, Contact
• Medhi Tahoori, KIT, DE, Contact