Technical Programme Committee 2013

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Topic: D13 Physical Design and Verification

Floorplanning; automatic place and route; module generation; design rule checking and layout characterization; electrical verification; problems in deep sub-micron and high-speed design; interconnect-driven and performance-driven layout; process technology developments; design for manufacturability.

Chair: Ralph Otten, TU Eindhoven, NL, Contact

Co-Chair: Azadeh Davoodi, University of Wisconsin - Madison, US, Contact

Members:

  • Cheng-Kok Koh, Purdue University, US, Contact
  • Jens Lienig, Technical University of Dresden, DE, Contact
  • Michael Orshansky, University of Texas at Austin, US, Contact
  • Sven Peyer, IBM, DE, Contact
  • Jose Pineda, NXP / TU Eindhoven, NL, Contact
  • Carl Sechen, UT Dallas, US, Contact
  • Rasit Topaloglu, IBM US, US, Contact
  • Evangeline Young, The Chinese University of Hong Kong, HK, Contact