W05 Second International Workshop on Resiliency in Embedded Electronic Systems (REES 2017)

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Wolfgang Müller, Universität Paderborn, DE (Contact Wolfgang Müller)
Daniel Müller-Gritschneder, Technische Universität München, DE (Contact Daniel Müller-Gritschneder)
Subhasish Mitra, Stanford University, US (Contact Subhasish Mitra)

This joint academic/industry workshop addresses all resiliency aspects in hardware and software systems design and operation from different embedded system areas such as automotive, avionics, and industry automation. This includes, but is not limited to, design bugs and cross-layer and cross-domain design techniques from software (applications, operating systems, middleware) to hardware (system, architecture, circuits, device level). Of special interest are design-for-resiliency technologies, resilient-specific design flows, like integrated functional/stochastic approaches, and development frameworks for robust designs, such as virtual prototyping approaches, which support early evaluations and estimations to obtain high reliability with less cost.

For latest information and detailed program please visit the REES website: www.edacentrum.de/rees


08:45 WELCOME Address
09:00 KEYNOTE Address: Multi-Layer-Resilience: The Need for Discipline
Wolfgang Ecker (Infineon Technology, Germany)
09:30 Session I: Resilient Systems Designs I
10:15 Poster Discussions (Session I) & Refreshments
10:45 Session II: Invited Industrial Talks - Resilient Systems in Practise
Novel ISO26262 Compliant Architecture for Advanced Driver Assistance Systems,
Luc van Dijk (NXP Semiconductors, The Netherlands)
Design-for-Resiliency in Dynamically Power Managed System,
Liangzehn Lai (ARM Ltd., UK)
11:45 Session III: Resilient Systems Design II
12:15 Lunch
13:15 Session IV: Invited Industrial Talks - Resilient Design Tools and Methods
Simultaneous Measurement of Defect Coverage and Tolerance in AMS ICs for ISO26262,
Stephen Sunter (Mentor Graphics, Canada)
Error Effect Simulation for Automotive using SystemC Virtual Prototypes,
Andreas Mauderer (Robert Bosch GmbH, Germany)
14:15 Session V: Fault Injection Automation
15:00 Poster Discussions (Session III+V) & Refreshments
15:30 Session VI: Resilient Circuit Analysis
16:15 Poster Discussions (Session VI)
17:00 End