Description:
With the advances of on chip/package integration technologies, a new generation of autonomous ultra low power integrated heterogeneous systems is emerging to cover wide range of applications including neural interface, sensor interface, autonomous wireless sensor network. A key technology required to master the design of these emerging applications is the integration of heterogeneous system to allow designers to integrate different components using different technologies and materials. This brings drastic possibilities to increase the functionalities of silicon-based components and then allow a strong cost and power reduction for the global system. Heterogeneous system integration is a multidisciplinary approach allowing flexible integration of different subsystems such as MEMS, power management, energy harvesting and power storage components, wireless communication and bioelectronics into single package.  This full day workshop brings together key actors from application, design and technologies to understand the potential of heterogeneous system integration and the shift towards autonomous ultra low power integrated systems. The program includes a keynote session to present strategic directions, two technical sessions to explore state-of-the-art research, a panel session to discuss major international initiatives targeting heterogeneous system integration.