Design for manufacturing and yield (DFM&Y) is rapidly becoming an indispensable consideration in today's SoCs.  Most current flows only consider manufacturability and yield at the lowest abstraction levels: process, layout and circuit.  As such, these metrics are treated as an afterthought and drive only local design changes.  With advanced process nodes the impact of design details on performance increases, making it increasingly expensive -- and soon prohibitive -- to guarantee 100% error free chips.  The challenge now is how to design reliable systems using circuits that may have faults due to manufacturing process fluctuations, exasperated by environmental factors such as voltage and temperature variations.  This leads to approaches that consider DFM&Y at the system level where more benefit can be reaped, and to consider the problems and solutions across the design layers.  This tutorial covers a cross layer approach to design for DFM&Y spanning from the application all the way to manufacturing, overviews the various techniques being explored currently, and demonstrates its effectiveness on key applications including wireless, multimedia and imaging.