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DATE04 PCB Symposium: Signal Integrity in Multi-Gigabit Designs  
 
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Session: PCB Symposium: Signal Integrity in Multi-Gigabit Designs Downloadable
Thu 0830-1300 Room: Dickens 1 & 2, Level D  
   PCB Symposium: Signal Integrity in Multi-Gigabit Designs [8F 9F]
[PDF 600 KB]
Org/Mod: carsten_elgert@mentor.com  
 
This year’s PCB Symposium which forms part of the free Exhibition Programme is themed Signal Integrity in Multi-Gigabit Designs.

While Signal-Integrity effects occur today even on the simplest boards, the PCBengineer faces a design discontinuity with completely new challenges when working on boards containing 3rd-generation serial I/O technology components. Prof. Thueringer from FH Giessen will present a keynote, covering fundamentals of signal integrity effects. Following are technical presentations by users and EDA vendors focusing on their experiences in designing systems-on-board and providing solutions for key challenges in this area. The target audience are the PCB- and System-design engineers who are involved in developing leading-edge products. Attendance at this session is free of charge and does not require pre-registration.

Please contact carsten_elgert@mentor.com no later than Jan 09, 2004 for details.

Thu 0830 Room: Dickens 1 and 2, Level D  
   Keynote: ‘Todays Challenges in High Speed Design’ [8F]
[PDF 7.3 MB]
Spks/Pans: Prof. Thueringer, FH Giessen  
 
Thu 0930 Room: Room Dickens 1 and 2, Level D  
   User Paper1: Ibis Modelling, benefits and limitations [8F]
[PDF 400 KB]
Spks/Pans: Eckhard Lenski, Siemens AG  
 
Thu 1000 Room: Dickens 1 and 2, Level D  
   Vendor paper 1 – Analysis Driven Routing Controlled by an Analogue Digital Mixed Signal Simulator: [8F]
[PDF 4 MB]
Spks/Pans: Stephane Rousseau, Mentor Graphics  
 
1030  SESSION BREAK  
 
Thu 1130 Room: Dickens 1 and 2, Level D  
   Vendor Paper 2: Behavioural Modelling for I/Os and Interconnect Structures for Applications in the GHz range: [9F]
[PDF 4.7 MB]
Spks/Pans: Heiko Dudek, Cadence  
 
Thu 1200 Room: Dickens 1 and 2, Level D  
   Vendor Paper 3: How to profit from losses: Beginners guide to lossy and lossless transmission lines: [9F]
[PDF 3 B]
Spks/Pans: Ralf Brüning, Zuken  
 
Thu 1230 Room: Dickens 1 and 2, Level D  
   User Paper 2: An efficient design process flow for Complex PCB design: [9F]
[PDF 1.5 MB]
Spks/Pans: Jean-Claude Simon, Alcatel  
 
1300 LUNCH  
Org/Mod=Organisors/Moderators, Spks/Pans=Speakers/Panellists
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Sponsored by the European Design and Automation Association, the EDA Consortium, the IEEE Computer Society - TTTC, ECSI, RAS and ACM SIGDA.