DATE 2008 SESSION INDEX
Keynote Addresses
1.2:
Transaction-Level Modelling (TLM)
1.3:
Invited Industrial Session - Industrial System Designs in Transportation and Information Technologies
1.4:
Application of Reconfigurable and Adaptive Systems
1.5:
Advances in BIST Techniques for Mixed-Signal Devices
1.6:
HOT TOPIC - Quantitative Evaluation in Embedded Systems Design
1.7:
System-Level Power Management and Energy Harvesting
2.2:
Heterogeneous System Modelling, Analysis and Implementation
2.3:
New Directions in Analogue Circuit Modelling
2.4:
Automotive System Design and Verification
2.5:
Advances in SoC Test
2.6:
Performance Analysis and Exploration of MPSoC Architectures
2.7:
Advanced Power Management Techniques
IP1 Interactive Presentations
3.2:
System Synthesis
3.3:
Analogue Simulation, Synthesis and Verification
3.4:
Aerospace Designs and MEMs Systems
3.5:
Fault Tolerant Techniques
3.6:
EMBEDDED TUTORIAL - Software for Wireless Networked Embedded Systems
3.7:
Power Optimisation by Supply and Ground Voltage Control
4.1:
Physical Architectures (Automotive Systems Day)
4.2:
High-Level Models for Validation
4.3:
Power Grid and Interconnect Modelling
4.4:
Algorithms and Architectures Optimisation for Baseband Processing
4.5:
DFX: Support for Test, Manufacturing, and Diagnosis
4.6:
Model-Based Design for Embedded Systems
4.7:
PANEL SESSION - Caution Ahead: The Road to Design and Manufacturing at 32 and 22 nm
IP2 Interactive Presentations
5.1.1:
Software Components for Reliable Automotive Systems (Automotive Systems Day)
5.1.2:
LUNCH-TIME KEYNOTE AND AWARDS (Automotive Systems Day)
5.2:
Timing-Based Validation
5.3:
Variation-Aware Modelling of Gates and Interconnects
5.4:
Signal Processing on Massive Parallel Architectures
5.5:
Statistical, Physical Defect Based Testing
5.6:
Tuning System Parameters for QoS Constrained Multimedia Appications
5.7:
EMBEDDED TUTORIAL - ARTEMIS and ENIAC Joint Undertakings: A new approach to conduct research in Europe
6.1:
Methods, Tools and Standards for the Analysis and Evaluation of Modern Automotive Architectures (Automotive Systems Day)
6.2:
Simulation-Based Validation
6.3:
Robust Mixed-Signal System Design
6.4:
Architectures for Wireless Communications
6.5:
HOT TOPIC - Test Challenges for Low Power Devices
6.6:
Software Architectures for Embedded Multi-CPU Systems
6.7:
Instruction-Set Optimisations
IP3 Interactive Presentations
7.1:
PANEL SESSION - The Future Car: Technology, Methods and Tools (Automotive Systems Day)
7.2:
Formal Methods for Hardware and Software Verification
7.3:
Physical Design: From Pins to Transistors
7.4:
Advanced Design Techniques for Sensor and Communication Applications
7.5:
Design Techniques for Error Mitigation
7.6:
Safety-Driven Embedded Systems Design
7.7:
Hot Topic - Quantitative Productivity Measurement in IC Design
8.1:
Dependable Computing in the Face of Scaled CMOS Challenges (Dependable Embedded Systems Day)
8.2:
Invited Industrial Session - Industrial System Designs in Information Technologies
8.3:
Power-Aware Circuit and Process Techniques
8.4:
Multicore Design Solutions
8.5:
Innovative and Emerging Technologies, Systems and Applications
8.6:
New Real-Time Scheduling Approaches and their Applications
8.7:
High-Level Synthesis and IP Protection
IP4 Interactive Presentations
9.1.1:
Synthesis of Dependable Embedded Systems (Dependable Embedded Systems Day)
9.1.2:
LUNCH TIME KEYNOTE - (Dependable Embedded Systems Day)
9.2:
HOT TOPIC - The Memory Challenge in NoC Based Systems
9.3:
Timing Issues in Logic Synthesis
9.4:
Secured Systems
9.5:
Test Generation for New Technologies
9.6:
Memory-Centric Code Optimisation
9.7:
Acceleration of Reconfigurable Applications
10.1:
Dependability Aspects (Dependable Embedded Systems Day)
10.2:
Application Mapping onto NoCs and Flow Control
10.3:
Arithmetic and Logic Processing
10.4:
Security Building Blocks
10.5:
A Smorgardsbord of Test
10.6:
HOT TOPIC - Analogue: How to Survive in the Era of Nano CMOS
10.7:
Reconfigurable Architectures and Run-Time Optimisations
IP5 Interactive Presentations
11.1:
PANEL SESSION - New Directions and Challenges (Dependable Embedded Systems Day)
11.2:
Routing and Link Design
11.3:
Microarchitecture Analysis and Optimisation
11.4:
System Implementations for Network and Cryptography
11.5:
Jitter Test and Fault Diagnosis
11.6:
Software Synthesis and Embedded Code Generation
11.7:
HOT TOPIC - 3D Integration or How to Scale in the 21st Century